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| Advance Product Information November 14, 2005 K Band Packaged Low Noise Amplifier Key Features * * * * * * TGA4506-SM 21-27 GHz Bandwidth 21 dB Nominal Gain 2.5 dB Nominal Noise Figure 10 dBm Nominal P1dB Bias: 3.5 V, 60 mA Package Dimensions: 4.0 x 4.0 x 1.1 mm (0.157 x 0.157 x 0.043 in) Measured Data Primary Applications * Point-to-Point Radio * Point-to-MultiPoint Radio S-Parameter (dB) 25 20 15 10 5 0 -5 -10 -15 -20 21 22 23 24 25 26 27 S11 S21 S22 Bias Conditions: Vd = 3.5 V, Id = 60 mA Product Description The TriQuint TGA4506-SM is a K-Band Packaged low noise amplifier. The TGA4506-SM operates from 21-27 GHz and is designed using TriQuint's production pHEMT process. The TGA4506-SM typically provides 2.5 dB noise figure and 21 dB small signal gain. The TGA4506-SM is ideally suited for Point-to-Point Radio and Point-toMultipoint Radio Communications. Evaluation Boards are available upon request. Lead-Free & RoHS compliant. Frequency (GHz) 4.5 4 3.5 3 NF (dB) 2.5 2 1.5 1 0.5 0 21 22 23 24 25 26 Freq (GHz) Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. 1 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM TABLE I MAXIMUM RATINGS 1/ SYMBOL Vd Vg Id Ig PIN PD TCH TM TSTG 1/ 2/ 3/ 4/ PARAMETER Drain Voltage Gate Voltage Range Drain Current Gate Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (30 Seconds) Storage Temperature VALUE 5V -1.5 TO 0V 190 mA 6 mA 9 dBm 0.24W 117 C 260 0C -65 to 150 C 0 0 NOTES 2/ 2/ 2/ 3/ 4/ These ratings represent the maximum operable values for this device. Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. When operated at this bias condition with a package base plate temperature of 85, the median life i s 1E+6 hrs. Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. 2 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM TABLE II ELECTRICAL CHARACTERISTICS (Ta = 25 0C Nominal) PARAMETER Drain Voltage, Vd Drain Current, Id Gate Voltage, Vg Small Signal Gain, S21 Input Return Loss, S11 Output Return Loss, S22 Noise Figure, NF Output Power @ 1 dB Compression Gain, P1dB TYPICAL 3.5 60 -0.5 to 0.0 21 11 15 2.5 10 UNITS V mA V dB dB dB dB dBm TABLE III THERMAL INFORMATION Parameter RJC Thermal Resistance (channel to backside of package) Test Conditions Vd = 3.5V ID = 0.06 A Pdiss = 0.21 W TCH (oC) 112.7 RTJC (qC/W) 132 TM (HRS) 1.52E+6 Note: Package backside SnPb soldered to carrier at 85C baseplate temperature. 3 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM Measured Data Bias Conditions: Vd = 3.5 V, Id =60 mA 4.5 4 3.5 NF (dB) 3 2.5 2 1.5 1 0.5 0 21 22 23 24 25 26 Frequency (GHz) 26 24 22 S21 (dB) 20 18 16 14 12 10 16 18 20 22 24 26 28 30 Frequency (GHz) 4 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM Measured Data Bias Conditions: Vd = 3.5 V, Id =60 mA 0 -2 -4 -6 S11 (dB) -8 -10 -12 -14 -16 -18 -20 16 18 20 22 24 26 28 30 Frequency (GHz) 0 -5 S22 (dB) -10 -15 -20 -25 -30 16 18 20 22 24 26 28 30 Frequency (GHz) 5 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM Measured Data Bias Conditions: Vd = 3.5 V, Id =60 mA 18 17 16 Output Power (dBm) 15 14 13 12 11 10 9 8 7 6 20 21 22 23 24 25 26 27 Psat P1dB Frequency (GHz) 0 -10 IMD3 (dBc) -20 -30 -40 -50 -60 -4 -2 0 2 4 6 8 10 Output Power per Tone (dBm) 20 GHz 21GHz 22GHz 23GHz 24GHz 25GHz 26GHz 27GHz 6 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM Package Pinout Diagram 16 17 18 19 20 1 TGA 4506 Date Code Lot code 15 14 21 13 2 3 12 4 11 10 9 5 8 7 6 Top View Dot indicates Pin 1 Bottom View P in 1, 5, 6, 10, 11, 15, 16, 20, 21 2, 4, 8, 9, 12, 14, 17, 18 3 19 13 7 D e s c r ip tio n GND NC R F In p u t Vg1 R F O u tp u t Vd1 7 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM Mechanical Drawing (Bottom Side) 19X 0.40 16 17 18 19 20 1 15 14 2.200.125 4.000.25 21 13 Ground Pad 3 2 12 4 11 10 9 5 8 7 6 2.200.125 3.20 4.000.25 20X 0.25 16X 0.65 (PITCH) 4X R0.13 3.20 Units: millimeters. Tolerance is 0.076mm unless otherwise specified 8 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 TGA4506-SM Recommended Board Layout Assembly AA Au WtAA$W 6qwAWtAAihvA Dq2%6 AA UvtA Ti AA UvtA Ti WqA2A"$W Au AA All measurements were made with the part soldered to 0.008 in thick RO4003 9 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 14, 2005 Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate SnPb 3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec Pb Free 3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec 10 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com |
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